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GlobalFoundries U.S. Inc
Singapore, Singapore
(on-site)
Posted
30 days ago
GlobalFoundries U.S. Inc
Singapore, Singapore
(on-site)
Job Type
Full-Time
Job Function
Other
Principal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant)
The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.
Principal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant)
The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.
Description
Introduction to GlobalFoundriesGlobalFoundries (GF) is one of the world's leading semiconductor foundries and the only one with a truly global footprint spanning three continents. We manufacture complex, feature-rich integrated circuits that enable billions of electronic devices. At GF, we make things that matter - from the solutions that enable the way we live today, to the technologies that drive what's possible for tomorrow. Join us in changing the industry that is changing the world. For more information, visit www.gf.com.
Introduction:
GlobalFoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.
Job Responsibilities:
- Manage new equipment start-up, qualification and tool matching to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
- Designing, executing, and analyzing experiments to develop advanced packaging process (bond/debond, die re-constitution, annealing/RTA) to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. Tool stability, cost of ownership) targets.
- Liaise & work with vendors to resolve equipment issues and improve equipment performance
- Improve Equipment robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
- Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity
- Sustain and improve on SPC, DOE, FDC, ECMS and all the statistical analysis tools to optimizing equipment robustness
- Implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
- Provide long term solution to address daily issues. Resolve department hardware chronicle issues
- To work closely with Process team to improve equipment productivity indices
- Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock
- Forecast financial budgets for equipment expenditures. Setup tracking system to monitor expenditure
- To coach and develop engineers on diffusion equipment maintenance knowledge & performing hardware trouble shooting
- Self audit and update specifications to meet TS16949 Quality Standard requirements
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Required Qualifications:
- BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required
- Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.
- Excellent verbal and written communication skills.
- Strong interpersonal skills and ability to work effectively with different cultures.
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
Job ID: 80478340

GlobalFoundries U.S. Inc
Semiconductor
Ballston Spa
,
NY
,
US
GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
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